4600 Automated Bondtester
Improve reliability and throughput while reducing human influence.
Overview
The 4600 Bondtester is a benchtop system designed to automatically perform complex test procedures without needing operator input. The system can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion.
Specifications at a Glance
| Testing | |
|---|---|
Test modes Test force Multi-function Cartridge (MFC) Imaging Process monitoring |
Manual + dual camera-assist automation 0.01 gf - 50 kgf Pull, shear + CBP available Autofocus + Compound Surface Imaging (CSI) Auto failure mode ID + wire detection |
| Automation | |
|---|---|
Sample handling Traceability Programming Light tower Factory communication |
Wafer + strip auto load Wafer OCR + strip ID Pattern transfer + file import 3 colour included Optional SECS / GEM & RS 232 |
| Axis Performance | |
|---|---|
Step back accuracy (force dependent) System accuracy (force dependent) Axis travel XY speed and resolution Z speed resolution |
+/- 0.25μm +/- 0.10% - 0.05 % FSL 450 mm x 410 mm x 75 mm Up to 70 mm/s, 100 nm 5 mm/s, 250 nm |
| Installation | |
|---|---|
Footprint (W x D x H) Weight Power Supply Pneumatic supply Vacuum supply (4600-W only) |
1075 mm x 920 mm x 1000 mm 140 kg 90-264 V, AC single phase Min 4.0 Bar Min 500 mm Hg |
Life with Automation
Maximum Operator Comfort
Every operator touch-point is an opportunity to degrade measurement spread. Ensure the most accurate results with operator-free automation.
Repeatable Results
Every time the 100 nm resolution rapid and closed loop motion system ensures the test tool is precise and never misses. Operators cannot match the accuracy and consistency of the test results.
Data is Everything
Achieve maximum data integrity and traceability with full barcode scanning support. Data is made available for your MES or factory host.
Remove the Expert
Paragon? software is easy to use, so you don¡¯t need to rely on expert operators to run the system. An operator can easily manage multiple systems rather than a single manual machine.
Data Integrity with Automation
Load large batches of samples and benefit from robotic handling to load, align and transfer each device to the Bondtester
Improve Tool ROI
Start the test then attend to other work while the system automatically completes large batch testing. Tests can be controlled and data exported using SECS/GEM protocols integrated with your factory.
Ultimate Product Safety
Using robotic handling with vacuum you can safely load and unload your product and protect from handling errors and damage. There is no risk of losing a batch and no need to ever repeat a test.
Maximum UPH
Fully integrated cassette handling and mapping capabilities combined with device mapping delivers maximum efficiency. Achieve consistent UPH results 24/7 regardless of who is operating the device.
Data that correlates
DataSync?
- Save costs and improve ROI - cartridges from older systems are compatible with the latest mainframes
- Guarantee data correlation - results correlate across all platforms from the 4000 Series to the 4800 INTEGRA™
- Seamless transition - no adaptors or cartridge alterations needed
- New mainframes are designed to accommodate new and old cartridge technology
Paragon - Your Automation Software
- Automation assisted GUI
- Build in check list & help
- Multi window views
- Schematic virtual images displayed
Application
Electronic systems have a range of test requirements including wire pull, ball shear, die shear and surface mount shear. Batteries for the automotive industry must ensure the highest level of safety.
Microelectronics
Test every interconnect or die
- Leadframes and strips
- Package substrates
- BGA
- MEM
Battery
For battery systems the intercell connection technology requires mechanical testing in either:
- Wirebond Ribbon
- To Busbar
- Tab Weld
- Destructive mode (sample testing)
- Non-destructive mode (100% testing)
Wafer Level
Test wafers from 2 inches to 8 inches
- Silicon, glass, laminate, composite, compound and warped wafers
- Pillars and bumps <50?m
- Test in any direction with the rotational shear cartridge
Multi Functional Cartridge
Nordson T&I cartridge technology is interchangeable between each of our systems, enabling new data to correlate with data up to 20 years old.
Resources & Downloads
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Brochures & Catalogs