Improves Yields Processes and Productivity
When you need the most efficient and effective measurement devices for semiconductor tool set-up and maintenance processes, count on Nordson Test & Inspection, the global market leader in wireless semiconductor measurement devices for chamber gapping, leveling, wafer handoff teaching, vibration, airborne particle, relative humidity and resistance measurement.
Semiconductor fabs and OEMs value the accuracy, precision and versatility of the WaferSense? and ReticleSense? measurement portfolio to enable improvements in fab yields and equipment uptime.
Proven and Adopted
- Major Semi fabs WW have adopted CYBE wireless measurement devices
- Adopted as the Best Known Method (BKM)
Most Efficient & Effective
- Travels anywhere a wafer or reticle travels
- Calibrations can be done under closed chamber processes
- Provides accurate, reliable and repeatable real-time data that saves time and expense compared to legacy methods
Save Time & Expense
- Improves yields and tool uptime
- Increases throughput
- Reduces resource needs
- Speeds equipment set-up, maintenance processes, trouble-shooting, qualification and release to production.
- Speeds tool optimization, stabilization and standardization.
- Streamlines fab processesEstablishes repeatable and verifiable standards
WaferSense® and ReticleSense®
Improves Yields Processes and Productivity
WaferSense® Auto Gapping System 2? (AGS2)
Improve Uniformity and Yield with the Wireless WaferSense AGS2 for Accurate and Repeatable Setups.
Learn moreWaferSense® Auto Multi Sensor? (AMS)
Speed vibration, leveling and humidity measurements with an all-in-one measurement device. Improve yields....
Learn moreWaferSense® Auto Vibration and Leveling Sensor? (AVLS3)
Speed real-time vibration and leveling measurements.
Learn moreWaferSense® Auto Teaching System? (ATS2)
Capture three dimensional offset data (x, y and z) to quickly teach wafer transfer positions.
Learn moreWaferSense® Airborne Particle Sensor? (APS3)
Improve equipment set-up and long-term yields by wirelessly monitoring airborne particles in real-time. Thinner....
Learn moreWaferSense® Auto Resistance Sensor? (ARS)
Real time resistance measurement of plating cell contacts.
Learn moreWaferSense® Auto Vibration System? (AVS)
Speed monitoring 3-axis accelerations and vibration to reduce particles, maintenance time and cycle time.
Learn moreReticleSense® Auto Multi Sensor? (AMSR)
Speed vibration, leveling and humidity measurements with an all-in-one measurement device. Improve yields.
Learn moreReticleSense® Auto Teaching System? (ATSR)
Improve equipment set-up and long term yields by wirelessly capturing three dimensional off-set data (x, y and z) in...
Learn moreReticleSense® Airborne Particle Sensor? (APSR/APSRQ)
Improve equipment set-up and long-term yields by wirelessly monitoring airborne particles in real-time. Thinner....
Learn moreWaferSense? Auto Gapping System? (AGS)
- Quickly achieve exactly the gap you need, using the chamber readings at process pressure in numerical and graphical form, with the easy-to-use CyberSpectrum? software.
- Achieve the best uniformity, whether you need to set a gap that is perfectly parallel or slightly tilted. Improve tool-to-tool process uniformity with objective and repeatable gap adjustments.
- Have peace of mind by taking the human variable out of adjusting your equipment.
- Make the right adjustments time after time.
WaferSense? Auto Teaching System? (ATS2)
- Auto Teaching System? (ATS2) Improve yields and lower particulate contamination with accurate wafer handoff calibration.
- Capture offset data for accurate calibration of transfer positions as the wafer-like ATS2 moves through your semiconductor equipment.
- Improve the yield of your manufacturing process with properly calibrated equipment. Achieve repeatable and reproducible semiconductor equipment setups.
- Eliminate technician-to-technician variation with the ATS2 calibration enables repeatable and reproducible setup and maintenance checks.
WaferSense? Airborne Particle Sensor? (APS3)
- Thinner. Lighter. Precision accuracy. The next generation of the APS improves equipment set-up and yields by wirelessly monitoring airborne particles in real-time.
- Quickly monitors, identifies and enables troubleshooting of airborne particles down to 0.14¦Ìm within semiconductor process equipment and automated material handling systems.
- Save time by swiftly locating contamination sources and see the effect of cleanings, adjustments and repairs in real time. Shorten equipment maintenance cycles with wafer-like form factor.
- Semiconductor fabs and OEMs worldwide value the accuracy, precision and versatility of the WaferSense APS3 ¨C The most efficient and effective wireless measurement device for airborne particles.
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Customer Portal
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White Papers and Customer Case Studies
As an industry leader, Nordson Test & Inspection is at the forefront of research and development. Read case studies and whitepapers on the latest developments in inspection and metrology equipment.
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